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Unveiling What Lies Beneath: Precision Cross-Sectional Analysis Using Ion Beam Polishing and SEM (COXEM IP-10K & EM-40)
1. Introduction
Understanding the internal structure of materials is a critical aspect of advanced materials analysis. While surface observation provides useful information, cross-sectional analysis enables deeper insight into internal morphology, interfaces, and structural integrity. However, conventional mechanical polishing methods often introduce deformation, scratches, or artifacts that can compromise the accuracy of microstructural interpretation.
In this study, a combined analytical approach using the COXEM Ion Beam Polisher (IP-10K) and Tabletop SEM (EM-40) was employed to achieve damage-free cross-sectional preparation and high-resolution imaging. This integrated workflow enables reliable observation from sample preparation to SEM analysis, ensuring accurate structural characterization.
2. Sample Preparation
Cross-sectional samples were prepared using the COXEM Ion Beam Polisher (IP-10K). Unlike mechanical polishing, ion beam polishing removes material through sputtering, allowing for:
- Damage-free surface preparation
- Elimination of mechanical deformation and scratches
- Preservation of original microstructure
The ion beam polishing process produced clean and uniform cross-sections, making it suitable for observing fine structures such as interfaces, pores, and internal defects.
3. SEM Analysis Conditions
SEM analysis was performed using the COXEM EM-40 Tabletop Scanning Electron Microscope under the following conditions:
- Accelerating voltage: 20 kV
- Working distance (WD): 9–40 mm
- Imaging mode: Backscattered Electron (BSE)
- Vacuum mode: Low Vacuum (Variable Pressure) Mode at 20Pa
- Magnification range: ×150 – ×2000
These conditions enabled clear visualization of compositional contrast and internal structural features.
4. Results and Discussion
SEM observations revealed significant differences between untreated and ion beam polished samples.
- Before ion beam polishing (Fig. a)
The cross-section exhibited surface roughness and structural distortion caused by mechanical polishing. Fine structural details were obscured due to damage and debris. - After ion beam polishing (Fig. b)
A clean and well-defined cross-section was obtained. Interfaces, phase boundaries, and internal structures were clearly visible without deformation.
Fig. (a)
Fig. (b)
- Higher magnification analysis (Fig. c, d)
The ion beam polished sample revealed detailed microstructural features such as:- Interface integrity
- Void distribution
- Crack propagation
- Fine compositional contrast
- Clearly defined grain structures suitable for EBSD analysis
Fig. (c)
Fig. (d)
These results demonstrate that ion beam polishing significantly improves the reliability and clarity of SEM observations.
5. Integrated Analysis Workflow (IP-10K + EM-40)
The combination of COXEM IP-10K and EM-40 provides a seamless workflow from sample preparation to imaging:
- Rapid cross-section preparation without mechanical damage
- High-quality surface suitable for EBSD and compositional analysis
- Clear visualization of internal structures using SEM
- Reduced analysis time and improved reproducibility
This integrated solution enables efficient and accurate analysis across a wide range of materials, from everyday products to advanced industrial components.
6. Conclusion
This study demonstrates that combining ion beam polishing with SEM imaging significantly enhances the accuracy and reliability of cross-sectional analysis. The COXEM IP-10K enables damage-free sample preparation by eliminating mechanical artifacts such as deformation and scratches, while the EM-40 provides high-resolution imaging that clearly reveals internal structures, interfaces, and defects.
The integrated COXEM solution offers a seamless analytical workflow—from preparation to observation—ensuring efficient operation and consistent results. With damage-free cross-sectioning, high-resolution SEM imaging, and compatibility with advanced techniques such as EBSD, this approach supports precise and comprehensive material characterization.
Ultimately, accurate analysis begins with proper sample preparation. By integrating ion beam polishing and SEM into a unified workflow, COXEM delivers a complete solution for uncovering hidden structures and enabling reliable, high-quality materials analysis across a wide range of applications.
